CT-LC Laser Cutting and Grooving Machine

Laser grooving is the result of the development of large integrated circuit. Because the more delicate of the line is, the more capacity of the slice of silicon. Many conpoents are deposited on a large slice of silicon or other semiconductor materials. Then the slice is cut into many cells in order to increase productivity and reduce production cost. The grooving machine process can be finished by laser. The laser grooving machine has many advantages being compared with many traditional methods. Please refer to following tables. Contrast between ND: YAG Laser grooving and traditional methods. Method Grooving GD GS PP MP Etching Narrower Shallow Slow Low High Grinder Wide Deep Middle Low High High rotating disc Wide Deep Middle Low High Diamond Wide Deep Middle Low High Supersonic Wide Middle Middle Low High Nd:YAG Laser Narrowest Shallow Fast High Lowest

Main Specifications: Laser wavelength: 1.06um Output power: 0-30w (continuously adjustable) Work frequency: 1-10KHz Grooving depth: 0.05-1mm Pulse width: 0-300ms Smallest facular diameter: 0.05mm